STRUCTURE AND COMPOSITION OF TITANIUM NITRIDE FILMS SYNTHESIZED BY MAGNETRON SPUTTERING

Yazarlar

  • А.Б. Божбанбай
  • Б.Ж. Сейтов

Özet

The article defines the conditions for obtaining the necessary composition of TiN films used as a diffusion barrier in solar cells. The conditions for obtaining the required thickness of the titanium nitride film are also determined. It was found by X-ray diffraction that the resulting titanium nitride film has a polycrystalline structure. As a result of a number of experiments, the conditions for obtaining a titanium nitride film with the required thickness of 75 nm and density (composition Ti0.57N0.43) were determined: magnetron power-690 W, pressure of the Ar-N2 mixture-0.54 Pa, nitrogen gas consumption 0.9 l/h, argon gas consumption 0.5 l/h, plate temperature 111 °C, deposition duration - 320 s.

Referanslar

В.И. Рудаков, В.Н. Гусев. Расчет профиля распределения концентрации меди в контактной системе TiN/CoSi2/Si при термическом нагреве // Микроэлектроника. 2009. Т.38, №4. С. 309-314.

Rudakov V.I., Gusev V.N. Formation of the TiN/CoSi2 system by rapid thermal annealing of a Co/Ti/Si structure // Russian Microelectronics. 2008. Т. 37. № 4. С. 215-225.

S. Wang, I. Raaijmakers, B.J. Burrow, S. Suthar, S. Redkar, K. Kim. Reactively sputtered TiN as a diffusion barrier between Cu and Si. //J. Appl. Phys. 68 (10). 1990. P. 5176-5187.

H. Miyzaki, K. Hinode, Y. Homma, K. Mukai. Extended Abstracts of 48th Full Meeting. // Jpn. Soc. Appl. Phys., 1987. P. 329.

J.D. Plummer, M.D. Deal, P.B. Griffin. 2000. Silicon VLSI Technology. P. 695.

C. Lee, Y-L. Kuo. The evolution of diffusion barriers in copper metallization // JOM. 2007. 1. P. 44-49.

V. Palekis, K. Singh, X. Feng, D. L. Morel and C. S. Ferekides, "Diffusion barriers for CdS/CdTe Solar cells fabricated on flexible substrates," 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC), 2013, pp. 1150-1155, doi: 10.1109/PVSC.2013.6744344.

K.Herz, A.Eicke, F.Kessler. R.Wächter, M.Powalla. Diffusion barriers for CIGS solar cells on metallic substrates // Thin Solid Films Volumes 431–432, 1 May 2003, Pages 392-397

R. H. van Leest, P. Mulder, G. J. Bauhuis, H. Cheun, H. Lee, W. Yoon, R. van der Heijden, E. Bongers, E. Vliega and J. J. Schermera. Metal diffusion barriers for GaAs solar cells // Phys. Chem. Chem. Phys., 2017,19, 7607-7616

N. Awaya and Y. Arita. Selective chemical vapor deposition of copper. Digest of Technical Papers. Symposium on VLSI Technology. Kyoto. Japan. May 1989. p.103.

R.E. Thomas, K.J. Guo, D.B. Aaron, E.A. Dobisz, J.H. Perepezko, J.D. Wiley. Investigation of amorphous Ni0.60Nb0.40 diffusion barriers // Thin Solid Films. 1987. 150. P. 245-252.

R.E. Thomas, J.H. Perepezko, J.D. Wiley. Crystallization of sputter deposited amorphous metal thin films. // Appl. Surf. Sci., 1986. 26. Iss. 4. P. 534-541.

N.W. Cheung, H. von Seefeld, M-A. Nicolet, Proceedings of the Symposium on Thin Film Interfaces and Interactions. J. E. E. Baglin and J. M. Poate, Eds. The Electrochemical Society. Princeton. 1980. Vol. 80-2. P. 323.

Yayınlanmış

2022-06-30